Holistic Lithography
The move to the 32-nm node and beyond presents unique challenges for the semiconductor industry. Ultra-low k1 production techniques mean it will no longer be enough to consider IC design, mask creation, lithography and metrology in isolation. Instead we will need a new integrated approach to IC manufacture. The ability to optimize multiple IC production steps simultaneously is fundamental to ASML's Holistic Lithography vision. Read More »
2013
SPIE Photomask Technology (BACUS)September 10-12, 2013
Monterey, CA
Recent News
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GLOBALFOUNDRIES partners with ASML for leading-edge chip tapeouts
Veldhoven, the Netherlands, March 18, 2013 - Brion Technologies, a division of ASML, today announces a major milestone in its partnership with GLOBALFOUNDRIES. The companies are collaborating to ...
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ASML Brion introduces solution for faster, more cost-effective mask data preparation for leading-edge chip designs
Veldhoven, the Netherlands, February 13, 2012 - Brion Technologies, a division of ASML, today announces a new product for semiconductor manufacturers who need the most powerful computational lithography ...
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ASML Brion Announces a New Mask Correction Capability to Enable Larger Process Windows for Advanced 2x nm Designs
Veldhoven, the Netherlands, September 19, 2011 - Brion Technologies, a division of ASML, today announced a new product for its popular Tachyon computational lithography platform. Tachyon MB-SRAF (Model-Based ...
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ASML and Brion unveil software that will optimize EUV manufacturing of the most advanced chips
Monterey, Calif., September 14, 2010 — Next generation semiconductor production will be facilitated by a new product introduced today by Brion Technologies, a division of ASML. Brion’s new ...
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