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Tachyon™ OPC+
Robust process-window OPC
without compromises
Built on the ultrafast and scalable Tachyon platform and enabled
by Tachyon's highly accurate, production-proven focus-exposure
modeling (FEM) model, Tachyon OPC+ delivers accurate and efficient
process-window optical proximity correction (OPC), while meeting
throughput and cost of ownership requirements for volume production
at the 45nm technology node and below.
Accuracy without Compromise
Tachyon OPC+ is the first OPC tool in the industry based on a hybrid
image- and geometry-based dual-engine architecture. This design
allows highly efficient image-based simulation and algorithms to
coexist with familiar geometry-based interfaces and polygon-based
operations. Tachyon OPC+ enables multiple evaluation points and
optimal dissection, eliminating variations in edge control, without
compromising cycle time. As a result, high-quality OPC output based
on accurate process window simulations can be obtained without approximations
and compromises.
Flexibility without Sacrificing Usability
Tachyon OPC+ software structure provides the user tiered levels
of access to the Tachyon OPC+ engine. Different levels of programmability
enable users to freely customize a solution in the most efficient
manner. C-API allows the user to compile their recipes into binaries
for IP protection, while high-level scripting language enables quick
prototyping and flow assembly. Fully parameterized built-in recipes
offer the users fully tested, and production-qualified OPC solutions.
Innovative OPC algorithms and high-quality implementations are built
into the Tachyon OPC+ engine, and are easily accessible through
C-API functions, scripting commands, and recipe parameters.
Model-based Subresolution Assist Feature (SRAF) Treatment
Tachyon OPC+ supports model-based SRAF treatment. The optimal locations
and sizes of SRAFs are systematically determined via model simulation
without requiring iterative trials and errors. The optimal SRAF
sizes and locations are captured via rules which can be used for
different designs. SRAF placements are automatically prioritized
based on process window metrics, and conflicts are resolved during
placement. Tachyon OPC+ also applies adjustments to the sizes and
locations of existing SRAF placements to ensure best process window
and non-printability, while maintaining Mask Rule Check (MRC) compliance.
Process-Window Aware Correction
Tachyon OPC+ corrects simultaneously for critical low k1
lithography yield parameters such as necking, bridging and contact
coverage at all process-window conditions. These process yield parameters
are embedded in Tachyon OPC+ to ensure optimal convergence, while
also adhering to MRC. The resulting OPC output is a production-worthy
process-window aware solution that avoids catastrophic defects due
to process variation. Tachyon's industry leading hardware-accelerated
platform delivers full OPC at each condition, without using approximation,
while introducing negligible throughput impact with cumulative focus
and exposure-window conditions additions.
Quality and Productivity
As technologies shrink and advanced RETs move into production, it
is necessary to monitor critical yield parameters through the entire
process window. With Tachyon OPC+, the users can control critical
yield parameters such as gate CD uniformity, necking, bridging and
contact coverage, across the entire process window, while maintaining
MRC compliance. Furthermore, with increasing design complexity and
the need for short cycle time in mask manufacturing, an intelligent
and comprehensive constraint handling technique is required during
OPC. Tachyon OPC+ integrates advanced model-aware MRC techniques
into the correction flow, resulting in efficient and accurate assurance
of manufacturability during the design phase.
Tachyon OPC+ delivers all of these benefits while reducing the total
turnaround time to hours, instead of days, without any accuracy
and productivity trade-off.
More OPC+ Information:
Data Sheet (.pdf)
Press Release
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