PRESS RELEASES

Brion Tachyon OPC+ Selected by Toshiba to Enable 45nm IC Production

SANTA CLARA, Calif., Feb. 20, 2008 — Brion Technologies, an ASML company, today announced that Toshiba Corp. has purchased and production qualified Brion’s Tachyon™ OPC+ optical proximity correction (OPC) solution for part of their leading-edge integrated circuits. Toshiba, a Brion customer continues to expand its use of Brion’s solutions to produce advanced devices. This latest purchase demonstrates the important role that Brion’s computational lithography tools continue to play in Toshiba’s production of advanced logic chips for use in a wide range of semiconductor applications.

One of the unique differentiators of Tachyon OPC+ is process-window OPC, which ensures consistent, reliable yield-aware correction over a wide range of process conditions. Thanks to the unmatched efficiency of Brion’s tightly integrated hardware and software platform, Tachyon OPC+ with process-window OPC improves yields with only minimal impact on run time. It not only enables highly accurate low k₁ lithography but also provides significant cost of ownership benefits.

“We are pleased to continue to support Toshiba’s production of low k₁ processes,” said Noriaki Kikuchi, president, Japan operations, Brion Technologies KK. “Toshiba’s decision to rely on Tachyon OPC+ for 45nm production demonstrates once again our leadership in computational lithography for advanced technology nodes.”

About k₁

Lithographers use the “process factor” k₁ to express the relative difficulty of a given lithography process. Improvements in lithography system capabilities, photoresist processes, and masks enable lithography at smaller k₁ values, which in turn allows chipmakers to produce devices with increasingly smaller features, with minimal sacrifice of process latitude.

About Brion Technologies

Brion Technologies is an ASML company and industry leader in computational lithography for integrated circuits. Brion’s Tachyon™ platform, an OPC and OPC verification system, enables capabilities that address chip design, photomask making and wafer printing for semiconductor manufacturing. Brion is headquartered in Santa Clara, California. For more information: www.brion.com or www.ASML.com

Media Relations Contact

Reeka Ninomiya – Corporate Communications – +1 408 200 0842 – Santa Clara, California

Investor Relations Contacts

Craig DeYoung – Investor Relations – +1 480 383 4005 – Tempe, Arizona

Franki D’Hoore – Investor Relations – +31 40 268 6494 – Veldhoven, the Netherlands

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